# HBM2E

> type of 3D-stacked synchronous dynamic random-access memory

**Wikidata**: [Q131460389](https://www.wikidata.org/wiki/Q131460389)  
**Source**: https://4ort.xyz/entity/hbm2e

## Summary
HBM2E (High Bandwidth Memory 2E) is a type of 3D-stacked synchronous dynamic random-access memory (DRAM). It is a subclass of High Bandwidth Memory designed to serve as a high-performance RAM interface. HBM2E offers a data transfer speed of 3,686.4 gigabits per second with an operating frequency of 1,800 megahertz, acting as the immediate predecessor to the HBM3 standard.

## Key Facts
- **Classification:** HBM2E is a subclass of High Bandwidth Memory (HBM), a high-performance RAM interface for 3D-stacked DRAM.
- **Data Transfer Speed:** The standard supports a data transfer speed of 3,686.4 gigabits per second.
- **Frequency:** It operates at a frequency of 1,800 megahertz.
- **Successor:** HBM2E is followed by HBM3.
- **Architecture:** It is defined as a type of 3D-stacked synchronous dynamic random-access memory.
- **Aliases:** Also known as "HBM 2E" and "High Bandwidth Memory 2E."
- **Parent Standard:** Belongs to the High Bandwidth Memory class, which is associated with AMD and Hynix.

## FAQs
### Q: What is HBM2E?
A: HBM2E stands for High Bandwidth Memory 2E. It is a type of 3D-stacked synchronous dynamic random-access memory (SDRAM) designed for high-performance applications.

### Q: How fast is HBM2E?
A: HBM2E has a data transfer speed of 3,686.4 gigabits per second and operates at a frequency of 1,800 megahertz.

### Q: What comes after HBM2E?
A: HBM2E is succeeded by HBM3, which is the subsequent type of 3D-stacked synchronous dynamic random-access memory.

## Why It Matters
HBM2E represents a critical iteration in the evolution of memory technology, bridging the gap between earlier High Bandwidth Memory generations and the newer HBM3 standard. As a subclass of the High Bandwidth Memory interface—originally developed through collaboration between AMD and Hynix—HBM2E pushes the boundaries of data throughput. By achieving a data transfer speed of 3,686.4 gigabits per second, it addresses the intense bandwidth requirements of high-performance computing environments. Its existence allows for greater memory density and speed within a compact 3D-stacked form factor, maintaining the synchronous dynamic random-access memory architecture while optimizing the interface for higher efficiency. This generation solidified the HBM standard's role in handling massive data workloads before the transition to HBM3.

## Notable For
- **High Bandwidth:** Delivers a substantial data transfer rate of 3,686.4 gigabits per second.
- **3D Stacking:** Utilizes 3D-stacked synchronous dynamic random-access memory architecture to maximize space and performance.
- **Performance Frequency:** Operates at 1,800 megahertz.
- **Lineage:** Acts as the direct predecessor to HBM3.
- **Industry Standard:** Represents a specific evolution of the High Bandwidth Memory interface originated by AMD and Hynix.

## Body
### Technical Classification
HBM2E is a type of 3D-stacked synchronous dynamic random-access memory (SDRAM). It falls under the broader class of **High Bandwidth Memory**, a high-performance RAM interface standard.

### Specifications
The memory is defined by its ability to handle massive amounts of data at high speeds. Key specifications include:
*   **Frequency:** 1,800 megahertz.
*   **Data Transfer Speed:** 3,686.4 gigabits per second.

### Development and Lineage
HBM2E is part of a continuous evolution of DRAM technology. It is a variant of the High Bandwidth Memory standard (originally associated with AMD and Hynix).
*   **Predecessor:** HBM2E follows earlier iterations in the HBM lineage (identified in structured data as following specification Q131460388).
*   **Successor:** The technology is immediately followed by **HBM3**.