# HBM package integration: Technology trends, challenges and applications

> Research article (2016 IEEE Hot Chips 28 Symposium (HCS), 2016) · cited 18× · AI/ML

**Wikidata**: [openalex:W2620776621](https://www.wikidata.org/wiki/openalex:W2620776621)  
**Source**: https://4ort.xyz/entity/hbm-package-integration-technology-trends-challenges-and-applications