# From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

> Research article (2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2022) · cited 18× · AI/ML

**Wikidata**: [openalex:W4313130853](https://www.wikidata.org/wiki/openalex:W4313130853)  
**Source**: https://4ort.xyz/entity/from-system-to-package-to-interconnect-an-artificial-intelligence-powered-3d-x-ray-imaging-solution-for-semiconductor-pa