# From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

> Research article (2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2018) · cited 23× · AI/ML

**Wikidata**: [openalex:W2891893709](https://www.wikidata.org/wiki/openalex:W2891893709)  
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