# From fan-out wafer to fan-out panel level packaging

> Research article (2015 European Conference on Circuit Theory and Design (ECCTD), 2015) · cited 17× · AI/ML

**Wikidata**: [openalex:W1907528524](https://www.wikidata.org/wiki/openalex:W1907528524)  
**Source**: https://4ort.xyz/entity/from-fan-out-wafer-to-fan-out-panel-level-packaging