# Failure Prediction Using Sequential Pattern Mining in the Wire Bonding Process

> Research article (IEEE Transactions on Semiconductor Manufacturing, 2017) · cited 23× · AI/ML

**Wikidata**: [openalex:W2729096782](https://www.wikidata.org/wiki/openalex:W2729096782)  
**Source**: https://4ort.xyz/entity/failure-prediction-using-sequential-pattern-mining-in-the-wire-bonding-process