# Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits

> Research article (Microelectronics Reliability, 2022) · cited 28× · AI/ML

**Wikidata**: [openalex:W4297883122](https://www.wikidata.org/wiki/openalex:W4297883122)  
**Source**: https://4ort.xyz/entity/equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits