# Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

> Research article (ACS Applied Materials & Interfaces, 2023) · cited 16× · AI/ML

**Wikidata**: [openalex:W4317951931](https://www.wikidata.org/wiki/openalex:W4317951931)  
**Source**: https://4ort.xyz/entity/electronic-packaging-enhancement-engineered-by-reducing-the-bonding-temperature-via-modified-cure-cycles