# Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias

> Research article (2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2016) · cited 13× · AI/ML

**Wikidata**: [openalex:W2581431263](https://www.wikidata.org/wiki/openalex:W2581431263)  
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