# Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

> Research article (Journal of Alloys and Compounds, 2016) · cited 115× · AI/ML

**Wikidata**: [openalex:W2311715612](https://www.wikidata.org/wiki/openalex:W2311715612)  
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