# Education 4.0 – Jump to Innovation with IoT in Higher Education

> Research article (2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2019) · cited 57× · AI/ML

**Wikidata**: [openalex:W3005723466](https://www.wikidata.org/wiki/openalex:W3005723466)  
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