# Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2019) · cited 16× · AI/ML

**Wikidata**: [openalex:W2948437533](https://www.wikidata.org/wiki/openalex:W2948437533)  
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