# Dynamic Mechanical Analysis and Viscoelastic Behavior of Epoxy Molding Compounds Used in Fan-Out Wafer-Level Packaging

> Research article (2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018) · cited 12× · AI/ML

**Wikidata**: [openalex:W2918191257](https://www.wikidata.org/wiki/openalex:W2918191257)  
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