# Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

> Research article (2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023) · cited 10× · AI/ML

**Wikidata**: [openalex:W4385541925](https://www.wikidata.org/wiki/openalex:W4385541925)  
**Source**: https://4ort.xyz/entity/die-embedded-glass-interposer-with-minimum-warpage-for-5g-6g-applications