# Development of Artificial Neural Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis

> Research article (2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021) · cited 12× · AI/ML

**Wikidata**: [openalex:W3192688433](https://www.wikidata.org/wiki/openalex:W3192688433)  
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