# Development of 3-layer stacked global shutter CMOS image sensor with pixel pitch Cu-to-Cu interconnection and high-capacity capacitors

> Research article (2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023) · cited 10× · AI/ML

**Wikidata**: [openalex:W4381745549](https://www.wikidata.org/wiki/openalex:W4381745549)  
**Source**: https://4ort.xyz/entity/development-of-3-layer-stacked-global-shutter-cmos-image-sensor-with-pixel-pitch-cu-to-cu-interconnection-and-high-capac