# Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing

> Research article (2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022) · cited 16× · AI/ML

**Wikidata**: [openalex:W4285103085](https://www.wikidata.org/wiki/openalex:W4285103085)  
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