# Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk

> Research article (2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020) · cited 12× · AI/ML

**Wikidata**: [openalex:W3118741098](https://www.wikidata.org/wiki/openalex:W3118741098)  
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