# Comparison Study of Common-Mode Noise and Thermal Performance for Lateral Wire-Bonded and Vertically Integrated High Power Diode Modules

> Research article (IEEE Transactions on Power Electronics, 2018) · cited 36× · AI/ML

**Wikidata**: [openalex:W2785483735](https://www.wikidata.org/wiki/openalex:W2785483735)  
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