# Comparison of advanced package warpage measurement metrologies

> Research article (2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016) · cited 12× · AI/ML

**Wikidata**: [openalex:W2565436415](https://www.wikidata.org/wiki/openalex:W2565436415)  
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