# Comparative Analysis of Package Warpage Using Confocal Method and Digital Image Correlation

> Research article (2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020) · cited 23× · AI/ML

**Wikidata**: [openalex:W3085491125](https://www.wikidata.org/wiki/openalex:W3085491125)  
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