# Assessment of 2x Thru De-embedding Accuracy for Package Transmission Line DUTs

> Research article (2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2020) · cited 12× · AI/ML

**Wikidata**: [openalex:W3094316845](https://www.wikidata.org/wiki/openalex:W3094316845)  
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