# An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor

> Research article (2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM), 2018) · cited 47× · AI/ML

**Wikidata**: [openalex:W2885839527](https://www.wikidata.org/wiki/openalex:W2885839527)  
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