# A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2021) · cited 13× · AI/ML

**Wikidata**: [openalex:W3216569667](https://www.wikidata.org/wiki/openalex:W3216569667)  
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