# A Thick Cu Layer Buried in Si Interposer Backside for Global Power Routing

> Research article (IEEE Transactions on Components Packaging and Manufacturing Technology, 2018) · cited 12× · AI/ML

**Wikidata**: [openalex:W2896338787](https://www.wikidata.org/wiki/openalex:W2896338787)  
**Source**: https://4ort.xyz/entity/a-thick-cu-layer-buried-in-si-interposer-backside-for-global-power-routing