# A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

> Research article (Journal of Electronic Packaging, 2020) · cited 35× · AI/ML

**Wikidata**: [openalex:W3082165571](https://www.wikidata.org/wiki/openalex:W3082165571)  
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