# A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC

> Research article (IEEE Transactions on Circuits and Systems I Regular Papers, 2020) · cited 10× · AI/ML

**Wikidata**: [openalex:W3047785674](https://www.wikidata.org/wiki/openalex:W3047785674)  
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