# A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology

> Research article (2023 International Electron Devices Meeting (IEDM), 2023) · cited 11× · AI/ML

**Wikidata**: [openalex:W4391594612](https://www.wikidata.org/wiki/openalex:W4391594612)  
**Source**: https://4ort.xyz/entity/a-0-5m-pixel-3-layer-stacked-cmos-image-sensor-with-deep-contact-and-in-pixel-cu-cu-bonding-technology