# 3D Printed Interconnects on Bendable Substrates for 3D Circuits

> Research article (2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2019) · cited 13× · AI/ML

**Wikidata**: [openalex:W2968577377](https://www.wikidata.org/wiki/openalex:W2968577377)  
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