# 3-Tier BSI CIS with 3D Sequential &amp; Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel

> Research article (2022 International Electron Devices Meeting (IEDM), 2022) · cited 10× · AI/ML

**Wikidata**: [openalex:W4317793354](https://www.wikidata.org/wiki/openalex:W4317793354)  
**Source**: https://4ort.xyz/entity/3-tier-bsi-cis-with-3d-sequential-amp-hybrid-bonding-enabling-a1-4um-pitch-106db-hdr-flicker-free-pixel
