# 3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers

> Research article (2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022) · cited 11× · AI/ML

**Wikidata**: [openalex:W4285103354](https://www.wikidata.org/wiki/openalex:W4285103354)  
**Source**: https://4ort.xyz/entity/3-layer-stacking-technology-with-pixel-wise-interconnections-for-image-sensors-using-hybrid-bonding-of-silicon-on-insula