# 3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications

> Research article (2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024) · cited 12× · AI/ML

**Wikidata**: [openalex:W4400033937](https://www.wikidata.org/wiki/openalex:W4400033937)  
**Source**: https://4ort.xyz/entity/3-layer-fine-pitch-cu-cu-hybrid-bonding-demonstrator-with-high-density-tsv-for-advanced-cmos-image-sensor-applications