# 2.5D integrated circuit

> combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit with through-silicon vias

**Wikidata**: [Q97609922](https://www.wikidata.org/wiki/Q97609922)  
**Wikipedia**: [English](https://en.wikipedia.org/wiki/2.5D_integrated_circuit)  
**Source**: https://4ort.xyz/entity/2-5d-integrated-circuit

## Summary
A 2.5D integrated circuit is a type of electronic component that combines multiple integrated circuit dies within a single package. Unlike three-dimensional integrated circuits (3D ICs), it arranges these dies side-by-side rather than stacking them vertically using through-silicon vias.

## Key Facts
- **Also known as:** 2.5D IC, 2.5D package
- **Classification:** Subclass of integrated circuit, integrated circuit packaging, and system in package (SiP).
- **Structure:** Combines multiple integrated circuit dies in a single module.
- **Differentiation:** distinct from 3D integrated circuits because it does not stack dies vertically.
- **Components:** Includes through-silicon vias as a part of its structure.
- **Google Knowledge Graph ID:** /g/11k5f520lm
- **Wikipedia Presence:** Available in 3 languages (English, Farsi, Chinese).

## FAQs
### Q: What is the primary difference between a 2.5D and a 3D integrated circuit?
A: The primary difference is the arrangement of the dies. A 2.5D integrated circuit places multiple dies side-by-side in a single package, whereas a 3D integrated circuit stacks them vertically on top of one another.

### Q: Is a 2.5D integrated circuit considered a System in Package (SiP)?
A: Yes, a 2.5D integrated circuit is classified as a type of System in Package (SiP), which groups multiple integrated circuits into a single module.

### Q: Does a 2.5D integrated circuit use through-silicon vias?
A: Yes, through-silicon vias are listed as a component or part of 2.5D integrated circuits, though they are used differently than in vertical 3D stacking.

## Why It Matters
The 2.5D integrated circuit represents a critical evolution in semiconductor packaging, bridging the gap between traditional 2D circuit boards and complex 3D stacking. By combining multiple dies—such as logic, memory, and sensors—into a single package without vertically stacking them, this technology allows for higher performance and density than standard packages while avoiding some of the thermal and manufacturing complexities associated with 3D architectures.

This architecture is significant for applications requiring high bandwidth and compact form factors. As a subclass of "system in package," it enables the integration of diverse technologies (heterogeneous integration) into a unified module. This allows electronics manufacturers to create more powerful and efficient devices without relying solely on the shrinking of individual transistor features, which is becoming increasingly difficult and expensive.

## Notable For
- **Side-by-Side Integration:** Distinguished by placing multiple dies next to each other rather than stacking them.
- **System in Package Classification:** Functions as a complete system enclosed in a single module.
- **Intermediary Architecture:** Serves as a middle ground between 2D planar circuits and 3D vertical stacking.
- **Component Integration:** Utilizes through-silicon vias (TSVs) within its structure.

## Body
### Technical Definition
A 2.5D integrated circuit is an electronic circuit format formed on semiconductor material. It is defined by its ability to combine multiple integrated circuit dies into a single package. The configuration is distinct from a three-dimensional integrated circuit (3D IC) specifically because it avoids stacking the dies directly on top of one another.

### Classification and Hierarchy
The entity falls under several key classifications within electronics engineering:
*   **Integrated Circuit:** It is fundamentally an electronic circuit formed on a flat piece of semiconductor material.
*   **System in Package (SiP):** It is a specific implementation of SiP, defined as a group of integrated circuits enclosed in a single module.
*   **Integrated Circuit Packaging:** It is a subclass of the packaging technologies used to protect and connect integrated circuits.

### Structural Components
While the dies are not stacked vertically as in 3D ICs, the 2.5D integrated circuit includes **through-silicon vias** (TSVs) as a structural component. This inclusion facilitates the high-density vertical electrical connections required to link the side-by-side dies to the underlying substrate or interposer, distinguishing the technology from simpler 2D wire-bonded packages.

### Identifiers
*   **Google Knowledge Graph ID:** /g/11k5f520lm
*   **Wikipedia Title:** 2.5D integrated circuit